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Your search returned 26 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components Hybrids And Manufacturing Technology
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Year : 1992 Volume number : 15 Issue: 04 |
Packaging Technology For The Nec Sx-3 Supercomputers
(Article)
Subject:
Supercomputer
,
Packaging Technology
,
Nec Sx-3
,
Cooling Systems
Author:
Toshikiko
Watari
Hiroshi
Murano
page:
411
-
417
High Density Multilayer Printed Circuit Board For Hitac M-880
(Article)
Subject:
High Density
,
Printed Circuit Board
,
Hitac M-880
Author:
A
Takahashi
Akira
Nagai
page:
418
-
425
Overview Of Packaging For The Ibm Enterprise System/9000 Based On The Glass-Ceramic Copper/Thin Film Thermal Conduction Module
(Article)
Subject:
Glass Ceramics
,
Copper
,
Thermal Conduction Modules
,
Ibm Enterprise System/9000
Author:
Rao R.
Tummala
Shakil
Ahmed
page:
426
-
431
Device Interconnection Technology For Advanced Thermal Conduction Modules
(Article)
Subject:
Interconnection Technologies
,
Thermal Conduction Modules
,
Device
,
Advanced
Author:
Raj N.
Master
Keith F.
Beckham
Sudipta K.
Ray
page:
432
-
437
Ultra-Dense: An Mcm-Based 3-D Digital Signal Processor
(Article)
Subject:
Ultra-Dense
,
Mcm-Based
,
3-D Digial
,
Signal Processor
Author:
Les J.
Wu
John M.
Segelken
Maureen Y.
Lau
page:
438
-
443
A Multichip Packaged Gaas 16x16 Parallel Multiplier
(Article)
Subject:
Multichip Package
,
Gaas 16x16
,
Parallel Multiplier
,
Multiplication
Author:
T
Sekiguchi
T.
Hirose
Masanori
Nishiguchi
Sosaku
Sawada
page:
444
-
450
Bond Wireless Multichip Packaging Technology For High-Speed Circuits
(Article)
Subject:
Wireless
,
Bond
,
Multichip Package
,
High-Speed Circuits
Author:
Leonard J.
Mahoney
Chang-Lee
Chen
Dean Z.
Tsang
page:
451
-
456
A Novel Multichip Module Assembly Approach Using Gold Ball Flip-Chip Bonding
(Article)
Subject:
Novel
,
Multichip Module
,
Flip-Chip
,
Bonding
Author:
Michael P.
Metroka
Cathryn E.
Goodman
page:
457
-
464
The Simulation Of High-Speed, High-Density Digital Interconnects In Single Chip Packages And Multichip Modules
(Article)
Subject:
Simulation
,
High-Speed
,
High Density
,
Single Chip Modules
Author:
Guang-Wen
Pan
Barry K.
Gilbert
page:
465
-
477
Characterization And Modeling Of Packages By A Time-Domain Reflectometry Approach
(Article)
Subject:
Characterization
,
Time-Domain Reflectometry
,
Package Modeling
,
Approach
Author:
Daniel
De Zutter
Marnix
Botte
Mieke
Herreman
Luc
Van Hauwermeiren
page:
478
-
482
S-Parameter-Based Ic Interconnect Transmission Line Characterization
(Article)
Subject:
S-Parameters
,
Ic Interconnects
,
Transmission Line Analysis
,
Characterization
Author:
Yungseon
Eo
William R.
Eisenstadt
page:
483
-
490
Modification Of `Spice' For Simulation Of Coupled Packaging Interconnections
(Article)
Subject:
Modification
,
Spice Simulation
,
Coupled Analysis
,
Packaging
Author:
Dongjin
Lee
O.A.
Palusinski
page:
491
-
496
Time-Domain Characterization Of Interconnect Discontinuities In High-Speed Circuits
(Article)
Subject:
Time Domain Characterization
,
Interconnections
,
Discontinuity
,
High-Speed Circuits
Author:
Vijai K.
Tripathi
Jyh-Ming
Jong
page:
497
-
504
A Molded Polymeric Resin-Filled Coupler
(Article)
Subject:
Polymeric
,
Resin-Filled Coupler
,
Mold Filling Simulation
Author:
Lee L.
Blyler, Jr.
Gary J.
Grimes
page:
505
-
509
Encapsulant For Nonhermetic Multichip Packaging Applications
(Article)
Subject:
Encapsulant
,
Nonholonomic System
,
Multichip Package
,
Packaging Technology
Author:
A.W.
Lin
Ching-Ping
Wong
page:
510
-
518
Thermomechanical Assessment Of Molding Compounds
(Article)
Subject:
Thermomechanical Analysis
,
Assessment
,
Molding Compounds
,
Thermal Cycle Stability
Author:
Otmar
Selig
Peter
Alpern
Kirsten
Muller
Rainer
Tilgner
page:
519
-
523
An Electrical Comparison Of Multimetal Tab Tapes
(Article)
Subject:
Electrical Comparison
,
Multimetal
,
Substrate
,
Tab Tapes
Author:
Soon Y.
Poh
Timothy L.
Michalka
page:
524
-
541
Evaluation Of Manufacturing Variables In The Reliability Of Surface Mount Capacitors
(Article)
Subject:
Evaluation
,
Manufacturing
,
Reliability
,
Surface Mount Technology
Author:
Lloyd
Condra
Aris
Christou
Grant M.
Johnson
Michael G.
Pecht
page:
542
-
552
A Dislocation Model Of Shear Fatigue Damage And Life Prediction Of Smt Solder Joints Under Thermal Cycling
(Article)
Subject:
Low Cycles Fatigue
,
Fatigue Life
,
Smt
,
Fatigue Damage
Author:
H.Y.
Lai
Y.Y.
Qian
Jihua
Huang
page:
553
-
558
A Fracture Mechanics Approach To Thermal Fatigue Life Prediction Of Solder Joints
(Article)
Subject:
Fracture Mechanics
,
Thermal
,
Fatigue Life Prediction
,
Solder Joint Reliability
Author:
Y.-H.
Pao
page:
559
-
570
3-D Measurement Of Thermal Deformations On An Ultra-High Density Circuit Moduled With A Laser Range Probe
(Article)
Subject:
Ultra-High
,
Laser Range Finders
,
3-D Measurement
,
Thermal Deformation
Author:
Warren H.
Stevenson
Paul J.
Gloeckner
Klod
Kokini
page:
571
-
577
A New Packaging Technology Using Micro-Solder Bumps For High-Speed Photoreceivers
(Article)
Subject:
Packaging Technology
,
Bumps
,
High-Speed Photoreceivers
,
Microsolder
Author:
Tsuyoshi
Hayashi
Kohsuke
Katsura
Hideki
Tsunetsugu
page:
578
-
582
Investigation Of Conduction Mechanism In Thick Film Resistors Trimmed By The Pulse Voltage Method
(Article)
Subject:
Conduction
,
Mechanism
,
Thick Film
,
Metal-Insulator-Metal (M-I-M) Model
Author:
T
Tobita
Hayato
Takasago
Komyo
Kariya
page:
583
-
589
Capacitor Loss At Radio Frequencies
(Article)
Subject:
Capacitors
,
Radio Frequency
,
Phenomenon
,
Permittivity
Author:
R.E.
Lafferty
page:
590
-
593
Thermal Stresses In Aluminum Lines Bounded To Substrates
(Article)
Subject:
Thermal Stresses
,
Aluminum
,
Substrate
,
Bonded
Author:
Anne I.
Sauter
William D.
Nix
page:
594
-
600
Accurate Experimental Characterization Of Interconnects: A Discussion Of `Experimental Electrical Characterization Of Interconnects And Discontinuities In High-Speed Digital Systems
(Article)
Subject:
Interconnects
,
Experimental
,
Electrical Characterization
,
Experimental Characterisation
Author:
Roger B.
Marks
Dylan F.
Williams
page:
601
-
604
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